Luca Maretti

eMAT Technology LLC

Projects

Interfacial Phenomena in Cu Plating

Lead Institution

eMAT Technology LLC

Principal Investigator

Valery Dubin

Project type

Large-Scale EMSL Research

Electroplated Cu on a physical vapor deposited (PVD) Cu seed layer with a PVD Ta-based barrier is now an integrated process for the production of advanced interconnects for integrated circuits (IC),…