Effect of Porosity and Surface Finish on Whisker Growth and Morphology
EMSL Project ID
31498
Abstract
Pb free coatings of electronic component leads and lead frames bring up the reliability issues of these components since pure Sn platings are highly prone to spontaneous whisker formation. Compressive stresses in the electroplated Sn deposits are believed to be the main drving force for the growth of Sn whiskers. Inclusion of porosity in electroplated Sn deposits is suggested to relieve stress and thereby prevent whisker growth. We propose to meticulously investigate the relationship between electroplating conditions, porosity and whisker growth and morphology. This will be accomplished by electroplating under various conditions and subsequent characterization of the Sn surface, including quantification of porosity and microstructural characterization. A relationship between porosity and whisker formation will be determined. Microstructural characterization of the substrate-Sn interface will be performed and correlated with whisker morphology. Effectiveness of various post-bake treatments will also be investigated. This proposal is general and non-proprietary and is in response to the open call. We are requesting standard access. In the initial stages, some rapid access for the porosity measurements may be required.
Project Details
Project type
Exploratory Research
Start Date
2008-10-11
End Date
2009-09-30
Status
Closed
Released Data Link
Team
Principal Investigator