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David Field

Institution
Washington State University

Projects

Analysis of the composition of Cu films

Lead Institution
Washington State University
Principal Investigator
David Field
Project type
Exploratory Research
Microstructure of Cu films used in modern integrated circuit interconnect lines is important in controlling both manufacturability and reliability of the in-service chip. The microstructure as it…

Cu Interconnect Structure in the FESEM

Lead Institution
Washington State University
Principal Investigator
David Field
Project type
Exploratory Research
Cu interconnect structure will be imaged using the LEO 982 FESEM. Orientations from select locations will be measured using EBSD. On a return trip, we will examine the evolved structure after…