Cu Interconnect Structure in the FESEM
EMSL Project ID
2352
Abstract
Cu interconnect structure will be imaged using the LEO 982 FESEM. Orientations from select locations will be measured using EBSD. On a return trip, we will examine the evolved structure after thermal cycling.
Project Details
Project type
Exploratory Research
Start Date
2001-09-13
End Date
2004-09-14
Status
Closed
Released Data Link
Team
Principal Investigator