Diane Hymes

LAM Research Corporation

Projects

Characterization and method development for back-end of the line wafer processing concepts

Lead Institution

LAM Research Corporation

Principal Investigator

Diane Hymes

Project type

Exploratory Research

Advanced concepts in back end of the line (BEOL) wafer processing are necessary to push semiconductor technology beyond the 90-nm node. Characterization of chips in this regime and for these…

Characterization and method development for back-end of the line wafer processing concepts

Lead Institution

LAM Research Corporation

Principal Investigator

Diane Hymes

Project type

Exploratory Research

Advanced concepts in back end of the line (BEOL) wafer processing are necessary to push semiconductor technology beyond the 90-nm node. Characterization of chips in this regime and for these…