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Characterization and method development for back-end of the line wafer processing concepts


EMSL Project ID
3158

Abstract

Abstract

Advanced concepts in back end of the line (BEOL) wafer processing are necessary to push semiconductor technology beyond the 90-nm node. Characterization of chips in this regime and for these concepts is an unsolved problem. We propose to develop and apply advanced charaterization methods in support of advanced semiconductor processing concepts.

Project Details

Project type
Exploratory Research
Start Date
2003-01-30
End Date
2006-02-05
Status
Closed

Team

Principal Investigator

Diane Hymes
Institution
LAM Research Corporation

Team Members

April Carman
Institution
Pacific Northwest National Laboratory

Rick Orth
Institution
Pacific Northwest National Laboratory

Glen Fryxell
Institution
Pacific Northwest National Laboratory

Barbara Tarasevich
Institution
Pacific Northwest National Laboratory

Dean Matson
Institution
Pacific Northwest National Laboratory

Alan Zacher
Institution
Pacific Northwest National Laboratory

Bruce Arey
Institution
Pacific Northwest National Laboratory

Clement Yonker
Institution
Pacific Northwest National Laboratory

John Fulton
Institution
Pacific Northwest National Laboratory

Related Publications

Foraita S, JL Fulton, ZA Chase, A Vjunov, P Xu, E Baráth, DM Camaioni, C Zhao, and JA Lercher. 2014. "Impact of the Oxygen Defects and the Hydrogen Concentration on the Surface of Tetragonal and Monoclinic ZrO2 on the Reduction Rates of Stearic Acid on Ni/ZrO2." Chemistry – A European Journal. doi:10.1002/chem.201405312