Transparent Circuits
EMSL Project ID
21609a
Abstract
We propose to apply nanomaterials and nanofabrication to the production of transparent circuits in large area on both rigid and flexible substrates.The project starts from the fabrication of an N-type transparent metal-oxide-semiconductor field effect transistor (MOSFET). Both commercialized indium tin oxide (ITO) coated glass and polyethylene terephthalate (PET) plastic will be adopted as the substrates on which the devices are constructed. The main frame of the device will be fabricated by controlled electrostatic self-assembly of different nanomaterials as the semiconducting and dielectric layers. The transparent electrode is made of ITO. Later, P-type MOSFET will be developed and circuits will be fabricated by integrating those devices into one system. We are also interested in other devices. In particular, the conductivity based transparent strain sensor will be under investigation for potential medical application.
This process dramatically broadens the availability of nanomaterials and substrates that are suitable to the circuit production. Due to the simple, low-cost, and low-temperature features of the nanoself-assembly technique, this approach is particularly suitable for the disposable circuit fabrication.
Project Details
Project type
Large-Scale EMSL Research
Start Date
2007-06-09
End Date
2008-09-07
Status
Closed
Released Data Link
Team
Principal Investigator
Related Publications
Zhang Q, LV Saraf, JR Smith, P Jha, and F Hua. 2009. "An Invisible Bend Sensor Based on Porous Crosslinked Polyelectrolyte Film." Sensors and Actuators. A, Physical 151(2):154-158. doi:10.1016/j.sna.2009.02.034
Zhang Q, YJ Shing, F Hua, LV Saraf, and DW Matson. 2008. "Fabrication of Transparent Capacitive Structure by Self-Assembled Thin Films." Journal of Nanoscience and Nanotechnology 8(6):3008-3012. doi:10.1166/jnn.2008.075