Structural and microstructural characterizations of Al6061/Al6061 interface microstructure of HIP bonded plates
EMSL Project ID
61055
Abstract
The objective of this proposal is to clarify the atomic- to-nanoscale mechanisms that influence the evolution of Al6061/Al6061 diffusion bonding, particularly in the context of cladding applications atop low enriched U-10Mo monolithic fuels. In the process of hot isostatic pressing (HIP) bonding, various factors such as different HIP process parameters, cleaning methods, strongback size and materials, surface texture are presently employed to ensure proper plate bonding with sufficient bond strength. Comprehending and predicting how these variables interact to affect the quality of HIP bonds a substantial scientific challenge. Finding a solution to this challenge is of paramount importance for cost-effective fuel fabrication and safe reactor operation. We propose that gaining insight into the structural and chemical composition occurring at the nanoscale along interface will enable us to uncover the fundamental mechanistic processes that underline the influence of HIP process parameters on the quality of interface bonding.
Project Details
Project type
Contracted Time
Start Date
2023-11-14
End Date
N/A
Status
Active
Released Data Link
Team
Principal Investigator